Amphenol Communications Solutions10077239-110LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Unshrouded Header | |
| HDR | |
| 10 | |
| 2 | |
| Press Fit | |
| 2.54 | |
| Straight | |
| 2.54 | |
| 3/Contact | |
| 1500VAC | |
| 5000 | |
| -65 | |
| 125 | |
| Bulk | |
| 12.7 | |
| 4.83 | |
| 10.62 | |
| 9.9 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.