TE Connectivity1206SFF500F/32-2Sicherungen
Fuse Chip Very Fast Acting 5A 32V SMD Solder Pad 1206 Ceramic T/R
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Very Fast | |
| Cell Phones|Digital Cameras|DVD Players|Game Systems|Laptops|Printer|Scanners | |
| 3.2 X 1.6 X 1.1 | |
| 5 | |
| 32 | |
| 32 | |
| 0.6 | |
| 0.015 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 1.1 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.

