SIBA GmbH158000.3,5Sicherungen
Fuse Chip Slow Blow Acting 3.5A 125V SMD Solder Pad 26.1 X 2.6 X 2.6mm Ceramic T/R
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Unknown |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| 26.1 X 2.6 X 2.6 | |
| 3.5 | |
| 125 | |
| 125 | |
| 38 | |
| Solder Pad | |
| 2 | |
| 2.6 | |
| 6.1 | |
| 2.6 | |
| Ceramic | |
| Surface Mount |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.