SIBA GmbH158000.0,8Sicherungen
Fuse Chip Slow Blow Acting 0.8A 125V SMD Solder Pad 6.1 X 2.6mm Ceramic T/R
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Unknown |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| 6.1 X 2.6 | |
| 0.8 | |
| 125 | |
| 125 | |
| 125 | |
| 1.5 | |
| Solder Pad | |
| 2 | |
| Tape and Reel | |
| 2.6 | |
| 6.1 | |
| 2.6 | |
| Ceramic | |
| Surface Mount |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.