SIBA GmbH160016.3,15Sicherungen
Fuse Chip Slow Blow Acting 3.15A 250V SMD Solder Pad 4.5 X 16mm Ceramic SEMKO/UL
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Unknown |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| Motor Circuit | |
| 4.5 X 16 | |
| 3.15 | |
| 250 | |
| 250 | |
| 1.2 | |
| 35 | |
| Solder Pad | |
| 2 | |
| 4.4 | |
| 16 | |
| 4.4 | |
| Ceramic | |
| Surface Mount |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
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