Weidmuller1630720000Steckverbinderleisten und Leiterplattenbuchsen
Conn Wire to Board F 3 POS 5.08mm Solder ST Top Entry Thru-Hole Box
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Wire to Board | |
| F | |
| 3 | |
| 1 | |
| Solder | |
| 5.08 | |
| Straight | |
| Dual Key | |
| 15 | |
| 300V | |
| 100 | |
| 5 | |
| -50 | |
| 100 | |
| 25 | |
| Box | |
| 2.97g | |
| 15.24 | |
| 10.3 | |
| 20.3 | |
| Contact Plating Thickness | (4-6)um |
| 3.2 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.