Molex2167000509Steckverbinderleisten und Leiterplattenbuchsen
Conn Board to Board RCP 50 POS 0.35mm Solder ST SMD SlimStack T/R
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Board to Board | |
| RCP | |
| 50 | |
| 2 | |
| Solder | |
| 0.35 | |
| Straight | |
| (5/0.3)/Contact | |
| 60VDC|60VAC | |
| 100 | |
| 80 | |
| -40 | |
| 85 | |
| 30 | |
| 0.019983 | |
| 11.2 | |
| 1.9 | |
| 0.56 | |
| SlimStack | |
| Contact Plating Thickness | 0.1um |
| Surface Mount |
| EDA / CAD Models |
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