SCHURTER3403.0266.23Sicherungen
Fuse Chip Slow Blow Acting 0.16A 277V SMD Solder Pad 15.4 X 5.35 X 5.35mm Ceramic T/R UL/VDE Automotive AEC-Q200
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| EA | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Yes |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| Explosion Protection|Industrial Electronic|Primary Protection on SMD PCB|Power Supply|Sensor | |
| 15.4 X 5.35 X 5.35 | |
| 0.16 | |
| 277 | |
| 277 | |
| 250 | |
| 0.41(Typ) | |
| 0.055 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.42 | |
| 5.35 | |
| 15.4 | |
| 5.35 | |
| Ceramic | |
| Surface Mount |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.

