SCHURTER3403.0278.11Sicherungen
Fuse Chip Slow Blow Acting 2.5A 277V SMD Solder Pad 16 X 5.3mm Ceramic Bag UL/VDE Automotive AEC-Q200
| Compliant with Exemption | |
| EAR99 | |
| Obsolete | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Yes |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| Explosion Protection|Industrial Electronic|Primary Protection on SMD PCB|Power Supply|Sensor | |
| 16 X 5.3 | |
| 2.5 | |
| 277 | |
| 277 | |
| 125 | |
| 0.98(Typ) | |
| 21 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Bag | |
| 5.35 | |
| 16.4 | |
| 5.35 | |
| Ceramic | |
| Surface Mount |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.

