SCHURTER3413.0327.24Sicherungen
Fuse Chip Slow Blow Acting 8A 32V SMD Solder Pad 1206 Epoxy Glass T/R UL
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Circuits With Inrush|Secondary Protection DC and AC | |
| 3.2 X 1.6 X 0.6 | |
| 8 | |
| 32 | |
| 32 | |
| 63 | |
| 14 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 90 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 0.6 | |
| Epoxy Glass | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
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Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.