Boyd Corporation371824B00000GKühlkörper
Heat Sink Passive BGA/FPGA Pin Array Adhesive Black Anodized
| Compliant | |
| EAR99 | |
| 8542.90.00.00 | |
| Automotive | Unknown |
| PPAP | Unknown |
| Passive | |
| Pin Array | |
| BGA|FPGA | |
| Epoxy | |
| Black Anodized | |
| Adhesive | |
| 35 | |
| 35 | |
| 7 |
| EDA / CAD Models |
KI-Systeme in der Medizin
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