Boyd Corporation374324B60023GKühlkörper
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
| Compliant | |
| EAR99 | |
| Active | |
| 8542.90.00.00 | |
| Automotive | Unknown |
| PPAP | Unknown |
| Passive | |
| Aluminum | |
| 30.6 | |
| Pin Array | |
| BGA|FPGA | |
| Clip | |
| Black Anodized | |
| Adhesive | |
| 27 | |
| 27 | |
| 10 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.