Molex430452012Steckverbinderleisten und Leiterplattenbuchsen
Conn Wire to Board HDR 20Power POS 3mm Solder ST Top Entry Thru-Hole Micro-Fit 3.0 Tray
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Wire to Board | |
| HDR | |
| 20Power | |
| 2 | |
| Solder | |
| 3 | |
| Straight | |
| Center Key | |
| 3 | |
| 8.5/Contact | |
| 600V | |
| 1000 | |
| 10 | |
| -40 | |
| 105 | |
| 30 | |
| Tray | |
| 2.697 | |
| 34.15 | |
| 8.77 | |
| 9.91 | |
| Micro-Fit 3.0 | |
| Contact Plating Thickness | (1.52/1.27)um |
| 3.18 | |
| Through Hole |
| EDA / CAD Models |
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