Amphenol Communications Solutions59112-G36-13-115LFSteckverbinderleisten und Leiterplattenbuchsen
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 26 Positions
| Compliant | |
| EAR99 | |
| Preliminary | |
| EA | |
| Automotive | No |
| PPAP | No |
| Board Stacker | |
| HDR | |
| 26 | |
| 2 | |
| Solder | |
| 2 | |
| Straight | |
| 2 | |
| 2/Contact | |
| 200VDC|200VAC | |
| 100000 | |
| 25 | |
| -55 | |
| 125 | |
| 100 | |
| Bulk | |
| 26 | |
| 4 | |
| 14.6 | |
| Minitek® | |
| 2.5 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.