Amphenol Communications Solutions75160-118-01LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,1 position, 2.54mm pitch
| Compliant | |
| EAR99 | |
| Obsolete | |
| Automotive | No |
| PPAP | No |
| Unshrouded Header | |
| HDR | |
| 1 | |
| 1 | |
| Solder | |
| Straight | |
| 5/Contact | |
| 110V | |
| -65 | |
| 130 | |
| Bag | |
| 2.54 | |
| 2.8 | |
| 8.26 | |
| 3.05 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.