Amphenol Communications Solutions-75970-8AP-04LF Steckverbinderleisten und Leiterplattenbuchsen BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,4 Positions, 2.54 mm (0.100in) Pitch

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Amphenol Communications Solutions75970-8AP-04LFSteckverbinderleisten und Leiterplattenbuchsen

BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,4 Positions, 2.54 mm (0.100in) Pitch

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Symbols and Footprints

Compliant

EAR99

Active

Automotive

No

PPAP

No

Board Stacker

HDR

4

1

Solder

2.54

Straight

3/Contact

1500VAC

-65

125

25

Bulk

10.16

2.4

41.02

Through Hole

EDA / CAD Models

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Vereinigte Staaten von Amerika
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- In Stock: 1.083 Stück
- Price: 0,5101 €