Amphenol Communications Solutions76745-1CH-18LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Board Stacker | |
| HDR | |
| 18 | |
| 2 | |
| Solder | |
| 2.54 | |
| Straight | |
| 2.54 | |
| 3/Contact | |
| 1500VAC | |
| 5000 | |
| -65 | |
| 125 | |
| Bag | |
| 22.86 | |
| 4.83 | |
| 23.02 | |
| Through Hole |
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.