Amphenol Communications Solutions77311-118-26LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch
| Compliant | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| Unshrouded Header | |
| HDR | |
| 26 | |
| 1 | |
| Solder | |
| 2.54 | |
| Straight | |
| 3/Contact | |
| 1500VAC | |
| 5000 | |
| -65 | |
| 130 | |
| 100 | |
| Bulk | |
| 66.04 | |
| 2.4 | |
| 8.38 | |
| 3.05 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.