Reduced Price
Amphenol Communications Solutions77313-802-10LFSteckverbinderleisten und Leiterplattenbuchsen
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Unshrouded Header | |
| HDR | |
| 10 | |
| 2 | |
| Solder | |
| 2.54 | |
| Straight | |
| 2.54 | |
| 3/Contact | |
| 1500VAC | |
| 5000 | |
| -65 | |
| 130 | |
| 100 | |
| Bag | |
| 12.7 | |
| 4.83 | |
| 8.38 | |
| BergStik® | |
| Contact Plating Thickness | 0.38um |
| 3.42 | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
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