Amphenol Communications Solutions-95278-402-16LF Steckverbinderleisten und Leiterplattenbuchsen BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating

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Amphenol Communications Solutions95278-402-16LFSteckverbinderleisten und Leiterplattenbuchsen

BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating

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Symbols and Footprints

Compliant

EAR99

Active

Automotive

No

PPAP

No

Unshrouded Header

HDR

16

2

Solder

2.54

Straight

2.54

3/Contact

1500VAC

5000

20

-65

125

Bulk

20.32

7.3

11.8

BergStik®

Surface Mount

EDA / CAD Models

6 Stück: Versand in vsl. 3 Tagen

Auf Lager
Versand in vsl. 3 Tagen
Ships from:
Niederlande
Date Code:
2133+
Manufacturer Lead Time:
18 Wochen
Country Of origin:
Frankreich
- In Stock: 6 Stück
- Price: 0,1603 €