Analog DevicesADRF5534BCPZN-R7 | 3.1 GHz to 4.2 GHz, Receiver Front EndHF-Frontend
LNA RF Front End 1.3dB 35.5dB 24-Pin LFCSP EP T/R
The ADRF5534 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications.
The ADRF5534 operates from 3.1 GHz to 4.2 GHz, and is configured with an LNA and a high-power, silicon, SPDT switch.
In the receive operation at 3.6 GHz, the LNA offers a low noise figure (NF) of 1.3 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.
In the transmit operation, the switch provides a low insertion loss of 0.8 dB and handles a long-term evolution (LTE) average power of 37 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.
The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.
Key Features and Benefits
- Integrated RF front end
- LNA and high-power silicon SPDT switch
- On-chip bias and matching
- Single-supply operation
- Gain: 35.5 dB typical at 3.6 GHz
- Gain flatness: 1.5 dB at 25°C across 400 MHz bandwidth
- Low noise figure: 1.3 dB typical at 3.6 GHz
- Low insertion loss: 0.8 dB typical at 3.6 GHz
- High-power handling at TCASE = 105°C
- Full lifetime
- LTE average power (8 dB PAR): 37 dBm
- Single event (<10 sec operation)
- LTE average power (8 dB PAR): 39 dBm
- Full lifetime
- High Input IP3: −4 dBm
- Low-supply current
- Receive operation: 120 mA typical at 5 V
- Transmit operation: 15 mA typical at 5 V
- Positive logic control
- 5 mm × 3 mm, 24-lead LFCSP package
Applications
- Wireless infrastructure
- TDD massive multiple input and multiple output (MIMO) and active antenna systems
- TDD-based communication systems
Evaluation Board
The ADRF5534 can be evaluated with the ADRF5534-EVALZ.
Block Diagrams and Tables


Featured Products
| Compliant | |
| 5A991.g | |
| Active | |
| 8542.39.00.90 | |
| Automotive | No |
| PPAP | No |
| LNA | |
| 3100 to 4200 | |
| 35.5 | |
| 1.3 | |
| -17 | |
| 4.75 | |
| 5 | |
| 5.25 | |
| -40 | |
| 105 | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.93 mm |
| Verpackungsbreite | 3 mm |
| Verpackungslänge | 5 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | CSP |
| Lieferantenverpackung | LFCSP EP |
| 24 |
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