Advanced Thermal SolutionsATS-55290R-C1-R0Kühlkörper

The ATS-55290R-C1-R0 is a heatsink designed for use with BGA packages commonly found on FPGAs, ASICs, and SoCs. The passive heatsink has a thermal resistance of 5.48°C/W. It is constructed with aluminum and features a black anodized finish. The surface-mounted heatsink has a cross-cut fin topology and has dimensions of 29 mm in length, 29 mm in width, and 19.5 mm in height. It is pre-assembled with a high-performance thermal interface material, which eliminates the need for thermal paste. The ATS-55290R-C1-R0 is compliant with RoHS-6 and REACH, making it applicable to the EU market.

Drawings/Package

Key Features

 -Black anodized finish

 -Passive heatsink for BGA packages

 -Self-adhesive thermal layer

 -RoHS-compliant

General Applications

 -FPGAs

 -SoCs

 -ASICs