BI TechnologiesBPC10103JWiderstand, fest, Einzeldurchsteckloch
Res Thick Film 10K Ohm 5% 10W ±100ppm/°C Molded RDL
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| Automotive | No |
| PPAP | No |
| 10K | |
| 5% | |
| 500(DC)|300(AC) | |
| 10 | |
| Thick Film | |
| -55 | |
| 155 | |
| ±100 | |
| 70 to 155 | |
| No | |
| No | |
| Molded | |
| Radial | |
| 2 | |
| 20.32 | |
| Not Formed | |
| Planar | |
| 25.4 | |
| 25.4 | |
| 25.4 | |
| 2.9 | |
| Through Hole |
| EDA / CAD Models |
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