Bel Power SolutionsC1T 4Sicherungen
Fuse Chip Slow Blow Acting 4A 63V SMD Solder Pad 1206 3.2 X 1.58 X 0.63mm Ceramic TUV/UL/cUL Automotive AEC-Q200
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | Yes |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| Industrial Equipment|LCD Monitor|Medical Equipment|Notebook|Office Electronic Equipment|Power Supply | |
| 3.2 X 1.58 X 0.63 | |
| 4 | |
| 63 | |
| 63 | |
| 63 | |
| 0.78 | |
| 50@63VAC|50@63VDC | |
| 2.56 | |
| 0.03 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| 1.58 | |
| 3.2 | |
| 0.63 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
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