Bel FuseC1T 2.5Sicherungen
Fuse Chip Slow Blow Acting 2.5A 63V SMD Solder Pad 1206 3.2 X 0.51 X 0.63mm Ceramic Automotive AEC-Q200
| Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| Automotive | Yes |
| PPAP | Unknown |
| Chip | |
| Slow Blow | |
| Industrial Equipment|LCD Monitor|Medical Equipment|Notebook|Office Electronic Equipment|Power Supply | |
| 3.2 X 0.51 X 0.63 | |
| 2.5 | |
| 63 | |
| 63 | |
| 63 | |
| 0.69 | |
| 1.07 | |
| 0.072 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| 0.51 | |
| 3.2 | |
| 0.63 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
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