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Fuse Chip Fast Acting 0.5A 63V SMD Solder Pad 0603 Ceramic T/R Automotive AEC-Q200
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | Yes |
| PPAP | Unknown |
| Chip | |
| Fast | |
| Battery Management System|Central Body Control Module|Digital Instrument Cluster | |
| 1.6 X 0.81 X 0.48 | |
| 0.5 | |
| 63 | |
| 63 | |
| 0.0019 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 0.81 | |
| 2.6 | |
| 0.48 | |
| Ceramic | |
| Surface Mount | |
| 0603 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.