| Not Compliant | |
| EAR99 | |
| Active | |
| COMPONENTS | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | No |
| PPAP | No |
| Cyclone® IV E | |
| 60nm | |
| 153 | |
| 8 | |
| 1.2 | |
| 22320 | |
| 66 (18x18) | |
| SRAM | |
| 594 | |
| 66 | |
| Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core | |
| Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley | |
| 22320 | |
| 20 | |
| 4 | |
| Yes | |
| No | |
| No | |
| No | |
| 7 | |
| B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL | |
| LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL | |
| DDR SDRAM|DDR2 SDRAM|QDRII+SRAM | |
| 1.15 | |
| 1.25 | |
| 1.2|1.5|1.8|2.5|3|3.3 | |
| -40 | |
| 100 | |
| Industrial | |
| Tray | |
| Cyclone | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.05 mm |
| Verpackungsbreite | 17 mm |
| Verpackungslänge | 17 mm |
| Leiterplatte geändert | 256 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 256 | |
| Leitungsform | Ball |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.