AmphenolG88MP041024CEUSteckverbinderleisten und Leiterplattenbuchsen
Micro Power Plus, Wafer 3.00mm Pitch Straight Dip
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| Wire to Board | |
| HDR | |
| Solder | |
| 3 | |
| 12.5/Contact | |
| 250VAC | |
| 1000 | |
| 10 | |
| -40 | |
| 105 | |
| 30 | |
| Tray | |
| Through Hole |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.