SamtecHDTM-6-08-1-S-VT-5-R-3Steckverbinder, Mutterplatine
Conn High Density Backplane HDR 96 POS 1.8mm Press Fit ST Thru-Hole Tray
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| High Density Backplane | |
| HDR | |
| 96 | |
| Press Fit | |
| 1.8 | |
| Straight | |
| 16 | |
| 1.5/Contact | |
| 68VDC|48VAC | |
| 1000 | |
| 10 | |
| -40 | |
| 105 | |
| 250 | |
| Tray | |
| 29.5 | |
| 14.26 | |
| 28.5 | |
| Through Hole |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.