Integrated Silicon Solution IncIS25WP128-RHLEFlash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 128M-bit 16M x 8 8ns 24-Pin TFBGA Automotive AEC-Q100
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| NOR | |
| 128M | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 24 | |
| 4Kbyte x 4096 | |
| 256byte | |
| 8 | |
| 16M | |
| Yes | |
| Synchronous | |
| 8 | |
| 90/Chip | |
| 0.8/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 133 | |
| 1.65 | |
| 1.8 | |
| 1.95 | |
| 1.65 to 1.95 | |
| 13 | |
| 30 | |
| -40 | |
| 105 | |
| Extended | |
| Yes | |
| No | |
| No | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.84(Max) mm |
| Verpackungsbreite | 6 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.