The LSM6DSO16IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in personal electronics and IoT solutions.
The LSM6DSO16IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. The module features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The LSM6DSO16IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any personal electronics, from wearable accessories to high-end applications.
The LSM6DSO16IS is available in a plastic land grid array (LGA) package.
All features
- • 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g
- • 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
- • Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience
- • Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)
- • Low noise: 70 μg/√Hz in high-performance mode
- • Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
- • SPI / I²C serial interface
- • Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
- • Temperature range from -40 to +85 °C
- • Embedded temperature sensor
- • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- • ECOPACK and RoHS compliant
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.86(Max) |
| Verpackungsbreite | 2.5 |
| Verpackungslänge | 3 |
| Leiterplatte geändert | 14 |
| Standard-Verpackungsname | LGA |
| Lieferantenverpackung | VFLGA |
| 14 |
| EDA / CAD Models |
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