TDKMLG0402Q8N2JT000Induktionsspule, Oberflächenmontage
Inductor RF Chip Unshielded Multi-Layer 0.0082uH 5% 100MHz 2Q-Factor Ceramic 0.14A 1.8Ohm DCR 01005 T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8504.50.40.00 | |
| Automotive | No |
| PPAP | No |
| RF Chip | |
| Multi-Layer | |
| Unshielded | |
| Ceramic | |
| 0.0082u | |
| 5% | |
| 100M | |
| 0.14 | |
| 0.14 | |
| 1.8 | |
| 2 | |
| 100M | |
| 4500M | |
| 2 | |
| 01005 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 0.42 | |
| Surface Mount | |
| 0.22 | |
| 0.22 |
| EDA / CAD Models |
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