TDKMLG0603P1N3CInduktionsspule, Oberflächenmontage
Inductor RF Chip Unshielded Multi-Layer 0.0013uH 0.2nH 500MHz 14Q-Factor Ceramic 0.8A 0.08Ohm DCR 0201
| Compliant | |
| EAR99 | |
| Unconfirmed | |
| Automotive | No |
| PPAP | No |
| RF Chip | |
| Multi-Layer | |
| Unshielded | |
| Ceramic | |
| 0.0013u | |
| 0.2nH | |
| 500M | |
| 0.8 | |
| 0.8 | |
| 0.08 | |
| 14 | |
| 500M | |
| 10000M | |
| 2 | |
| 0201 | |
| -55 | |
| 125 | |
| 0.63 | |
| Surface Mount | |
| 0.33 | |
| 0.33 |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.