TDKMLG0603Q3N3SInduktionsspule, Oberflächenmontage
Inductor RF Chip Unshielded Multi-Layer 0.0033uH 0.3nH 100MHz 5Q-Factor Ceramic 0.3A 0.3Ohm DCR 0201
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8504.50.80.00 | |
| Automotive | No |
| PPAP | No |
| RF Chip | |
| Multi-Layer | |
| Unshielded | |
| Ceramic | |
| 0.0033u | |
| 0.3nH | |
| 100M | |
| 0.3 | |
| 0.3 | |
| 0.3 | |
| 5 | |
| 100M | |
| 5800M | |
| 2 | |
| 0201 | |
| -55 | |
| 125 | |
| 0.63 | |
| Surface Mount | |
| 0.33 | |
| 0.33 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.