Infineon Technologies AGS25FL256LDPBHN023Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 24-Pin BGA T/R
| Compliant | |
| 3A991.b.1.a | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 256M | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 4Kbyte x 8192 | |
| 256byte | |
| 1/2/4 | |
| 256M/128M/64M | |
| Yes | |
| Synchronous | |
| 8 | |
| 360/Chip | |
| 1.2/Page | |
| 65nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 133 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 50 | |
| -40 | |
| 125 | |
| Extended | |
| Yes | |
| No | |
| No | |
| 100000 | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.2(Max) - 0.2(Min) mm |
| Verpackungsbreite | 6 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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