Infineon Technologies AGS25HS01GTDPBHM030Flash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 8ns 24-Pin BGA Tray Automotive AEC-Q100
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| NOR | |
| 1G | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 256Kbyte x 512 | |
| 256byte|512byte | |
| 1/2/4 | |
| 1G/512M/256M | |
| Yes | |
| Synchronous | |
| 8 | |
| 1381/Chip | |
| 1.7/Page | |
| 45nm | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 133 | |
| 1.8 | |
| 2 | |
| 1.7 to 2 | |
| 72 | |
| 66 | |
| -40 | |
| 125 | |
| Automotive | |
| Yes | |
| Yes | |
| No | |
| 2560000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1(Max) - 0.2(Min) mm |
| Verpackungsbreite | 8 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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