Infineon Technologies AGS29AL016J70BFI010Flash
NOR Flash Parallel 3V/3.3V 16M-bit 2M x 8/1M x 16 70ns 48-Pin FBGA Tray
| Compliant | |
| EAR99 | |
| LTB | |
| 8542.32.00.51 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 16M | |
| Sectored | |
| Yes | |
| Asymmetrical | |
| Top | |
| 21/20 | |
| 64Kbyte x 31|32Kbyte x 1|16Kbyte x 1|8Kbyte x 2 | |
| 8/16 | |
| 2M/1M | |
| Yes | |
| Asynchronous | |
| 70 | |
| 10/Sector | |
| 160000/Chip | |
| 30 | |
| 110nm | |
| Parallel | |
| 2.7 | |
| 3.3|3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 12 | |
| 30 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| No | |
| No | |
| 100000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1(Max) - 0.18(Min) mm |
| Verpackungsbreite | 6.15 mm |
| Verpackungslänge | 8.15 mm |
| Leiterplatte geändert | 48 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | FBGA |
| 48 | |
| Leitungsform | Ball |
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.