Infineon Technologies AGS70GL02GS12FHBV20Flash
NOR Flash Parallel 3V/3.3V 2G-bit 128M x 16 120ns 64-Pin Fortified BGA Tray Automotive AEC-Q100
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| NOR | |
| 2G | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 27 | |
| 128Kbyte x 2048 | |
| 16Words/32byte | |
| 16 | |
| 128M | |
| Yes | |
| Asynchronous | |
| 120 | |
| 20 | |
| 25 | |
| 65nm | |
| Parallel | |
| 2.7 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 60 | |
| 100 | |
| -40 | |
| 105 | |
| Automotive | |
| Yes | |
| No | |
| Yes | |
| 100000(Typ) | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.4(Max) - 0.4(Min) |
| Verpackungsbreite | 11 |
| Verpackungslänge | 13 |
| Leiterplatte geändert | 64 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | Fortified BGA |
| 64 | |
| Leitungsform | Ball |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.
