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• Kategorie
• Beschreibung
• Bestand
• Maximum Junction Case Thermal Resistance - (°C/W)
• Category
• Configuration
• Number of Elements per Chip
• Operating Junction Temperature - (°C)
• Maximum Drain-Source Resistance - (mOhm)
• Maximum Drain-Source Voltage - (V)
• Channel Mode
• Maximum Gate Threshold Voltage - (V)
• Typical Fall Time - (ns)
• Supplier Package
• Tradename
• Typical Rise Time - (ns)
• Maximum Continuous Drain Current Range - (A)
• Process Technology
• Typical Gate Charge @ Vgs - (nC)
• Channel Type
• Maximum IDSS - (uA)
• Maximum Gate-Source Voltage - (V)
• Package Family Name
• Maximum Power Dissipation - (mW)
• Maximum Operating Temperature - (°C)
• Maximum Continuous Drain Current - (A)
• Material
• Minimum Operating Temperature - (°C)
• Typical Turn-On Delay Time - (ns)
• ROHS
• Pin Count
• Typical Gate Charge @ 10V - (nC)
• Life Cycle
• Typical Turn-Off Delay Time - (ns)
• Maximum Junction Ambient Thermal Resistance - (°C/W)
• Typical Input Capacitance @ Vds - (pF)
• Typical Output Capacitance - (pF)
• Packaging

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