50-75% Rabatt
BournsSF-0402FP300-2Sicherungen
Fuse Chip Fast Acting 3A 32V SMD Solder Pad 0402 Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Fast | |
| Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller | |
| 1 X 0.52 X 0.35 | |
| 3 | |
| 32 | |
| 32 | |
| 35@32VDC | |
| 0.05427 | |
| 0.02 | |
| Solder Pad | |
| 2 | |
| -20 | |
| 105 | |
| Tape and Reel | |
| 0.52 | |
| 1 | |
| 0.35 | |
| Ceramic | |
| Surface Mount | |
| 0402 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.