BournsSF-0402S125-2Sicherungen
Fuse Chip Slow Blow Acting 1.25A 24V SMD Solder Pad 0402 Ceramic T/R UL
| Compliant | |
| EAR99 | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller|Battery Charger | |
| 1 X 0.52 X 0.35 | |
| 1.25 | |
| 24 | |
| 24 | |
| 35@32VDC | |
| 0.0231 | |
| 0.045 | |
| Solder Pad | |
| 2 | |
| -20 | |
| 105 | |
| Tape and Reel | |
| 0.52 | |
| 1 | |
| 0.35 | |
| Ceramic | |
| Surface Mount | |
| 0402 |
| EDA / CAD Models |
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