BournsSF-0603HIA450M-2Sicherungen
Fuse Chip 4.5A 32V SMD Solder Pad 1.6 X 0.8mm Ceramic T/R Automotive AEC-Q200
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | Yes |
| PPAP | Yes |
| Chip | |
| 1.6 X 0.8 | |
| 4.5 | |
| 32 | |
| 32 | |
| 2.68 | |
| 0.015 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 0.8 | |
| 1.6 | |
| 0.8 | |
| Ceramic | |
| Surface Mount |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.