50-75% Rabatt
BournsSF-0603SP080-2Sicherungen
Fuse Chip Slow Blow Acting 0.8A 32V SMD Solder Pad 0603 Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Battery Charger|Cell Phone|Digital Camera|Disk Drive|Industrial Controller | |
| 1.6 X 0.8 X 0.45 | |
| 0.8 | |
| 32 | |
| 32 | |
| 50@32VDC | |
| 0.023 | |
| 0.143 | |
| Solder Pad | |
| 2 | |
| -20 | |
| 105 | |
| Tape and Reel | |
| 0.8 | |
| 1.6 | |
| 0.45 | |
| Ceramic | |
| Surface Mount | |
| 0603 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.