BournsSF-1206HIA600M-2Sicherungen
Fuse Chip 6A 24V SMD Solder Pad 1206 Ceramic T/R Automotive AEC-Q200
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | Yes |
| PPAP | Yes |
| Chip | |
| 3.2 X 1.6 X 0.97 | |
| 6 | |
| 24 | |
| 24 | |
| 12.8 | |
| 0 0.013 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 150 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 0.97 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.