25-50% Rabatt
BournsSF-1206S315W-2Sicherungen
Fuse Chip Slow Blow Acting 3.15A 65V SMD Solder Pad 1206 3.2 X 1.6 X 1.08mm Copper T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Backlight Driver|DC-DC Converter|Industrial Controller|LCD Monitor|Low Voltage Lighting Power|Notebook|Set Top Box | |
| 3.2 X 1.6 X 1.08 | |
| 3.15 | |
| 65 | |
| 65 | |
| 2.22 | |
| 0.0199 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 1.08 | |
| Copper | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.