BournsSF-1206S800M-2Sicherungen
Fuse Chip Slow Blow Acting 8A 32V SMD Solder Pad 1206 3.2 X 1.6 X 0.85mm Ceramic T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Slow Blow | |
| Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller | |
| 3.2 X 1.6 X 0.85 | |
| 8 | |
| 32 | |
| 32 | |
| 45@32VDC | |
| 2.32 | |
| 0.008 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 1.6 | |
| 3.2 | |
| 0.85 | |
| Ceramic | |
| Surface Mount | |
| 1206 |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.