25-50% Rabatt
BournsSF-2410HI500T-2Sicherungen
Fuse Chip 5A 125V SMD Solder Pad 2410 6.1 X 2.59 X 2.59mm Ceramic T/R cUL
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | No |
| PPAP | No |
| Chip | |
| Battery Protection|LCD Backlight Inverter|LCD Monitor|Notebook|PC Server|POE|POE+|Power Supply|White Goods | |
| 6.1 X 2.59 X 2.59 | |
| 5 | |
| 125 | |
| 125 | |
| 125 | |
| 50@125VAC|50@125VDC|300@32VDC | |
| 50.308 | |
| 0.0112 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 2.6 | |
| 6.1 | |
| 2.6 | |
| Ceramic | |
| Surface Mount | |
| 2410 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.