Reduced Price
BournsSF-3812F3500T-2Sicherungen
Fuse Chip Fast Acting 35A 250V SMD Solder Pad 3812 10.1 X 3.1mm Ceramic T/R
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | No |
| PPAP | No |
| Chip | |
| Fast | |
| Battery Management System|Blade Computing|PC Server|Power Supply|Voltage Regulator Module | |
| 10.1 X 3.1 | |
| 35 | |
| 250 | |
| 250 | |
| 100@250VAC|150@125VAC|130@80VDC|300@72VDC | |
| 1320 | |
| 0.0014 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 3.1 | |
| 10.1 | |
| 3.1 | |
| Ceramic | |
| Surface Mount | |
| 3812 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.