BournsSF-3812F4000T-2Sicherungen
Fuse Chip Fast Acting 40A 250V SMD Solder Pad 3812 10.1 X 3.1mm Ceramic T/R
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | No |
| PPAP | No |
| Chip | |
| Fast | |
| Battery Management Systems|Blade Computing|Power Supplies | |
| 10.1 X 3.1 | |
| 40 | |
| 250 | |
| 250 | |
| 100 | |
| 1897.6 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| 3.1 | |
| 10.1 | |
| 3.1 | |
| Ceramic | |
| Surface Mount | |
| 3812 |
| EDA / CAD Models |
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