BournsSF-3812TL200TSSicherungen
Fuse Chip 2A 250V SMD Solder Pad 3812 10 X 3.2 X 3.2mm Ceramic
| Compliant with Exemption | |
| EAR99 | |
| Active | |
| 8536.10.00.40 | |
| Automotive | No |
| PPAP | No |
| Chip | |
| Lighting System | |
| 10 X 3.2 X 3.2 | |
| 2 | |
| 250 | |
| 250 | |
| 19.67 | |
| Solder Pad | |
| 2 | |
| -55 | |
| 125 | |
| 3.2 | |
| 10 | |
| 3.2 | |
| Ceramic | |
| Surface Mount | |
| 3812 |
| EDA / CAD Models |
UAV-Bedrohungen wirksam abwehren
So entsteht ein integriertes Counter-UAV-Abwehrsystem mit Intelligent Processing, Sensorik und Rapid Response.